Lasers are able to cut out samples of other structures out of wafers. The image shows a cut made with an cost-effective IR laser. Processing with this type of laser is very fast, but debris can remain on the edges. With our UV lasers, the cut is much more clean and the cut is with almost no crystal modification.

With processing in a glove box or vacuum chamber and applying supporting gases, any oxidation can be suppressed. It is also possible to enhance oxides with applying oxidizing gases.

Another benefit of processing in a glove box is that harmful materials like GaAs or CdTe can be processed without contamination of the environment. Therefore, our glove box de-isolation filters are inside the glovebox. This ensures a filter exchange without any contamination of the lab.

The image shows samples cut out of a crystalline silicon solar cell. The cell is still active after the cut. With this process, small solar cells can be cut out of cheap conventional large solar wafers.