Repair of micro electronics. Devices can be cut out or electrically separated by ablating of layers with 2 to 3 µm precision.
Stress-free laser cutting and electrical separation
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Send us your request and we will get back to you.
Repair of micro electronics. Devices can be cut out or electrically separated by ablating of layers with 2 to 3 µm precision.
Stress-free laser cutting and electrical separation
Send us your request and we will get back to you.
