Versatile multi-wavelength laser systems for selective material processing
We provide advanced laser systems that combine multiple wavelengths—1064 nm, 532 nm, and 355 nm—in a single, integrated solution. This enables precise, material-selective layer processing within one setup.
The systems are built with 3 wavelength mirrors and lenses. To control spot diameter and spot position independently, zoom beam expanders are implemented individually for each wavelength. It is also possible to process with different wavelengths at the same time.
For example:
- 532 nm effectively removes semiconductor materials from transparent electrodes.
- 355 nm can ablate transparent electrodes from glass substrates.
- 1064 nm allows for the removal of metal electrodes from semiconductor layers.
The desired wavelength can be selected via computer control, allowing flexible, automated processing of different material layers in a single workflow.
System with 1064 nm, 532 nm, and 355 nm beams in a single unit.Spot diameter and focal position are individually adjustable for each wavelength via dedicated zoom beam expanders. Computer-controlled beam expanders are available as an option.
Our femto, pico and nanosecond laser portfolio
Every circle indicates an available laser with a fixed pulse duration.
Every line indicates a laser with a variable pulse duration with a range of pulse duration.
The pulse durations are selectable via computer and can be part of a receipt.
3 different wavelengths in one laser source
Enclosures, modules, and handling systems for processing in air, glove box, ultra-high vacuum (UHV) and electro-chemical environment
Stand-alone laser system for processing in air
Stand alone laser scriber für ambient air for > 140 mm x 140 mm working ares with vision system for P1, P2, P3, LED and contact exposure
UHV chamber for laser processing in ultra-high vacuum
Laser system for glove box for processing in inert atmosphere like argon or nitrogen (laser source outside)
Laser system for processing on substrates up to 1.2 m x 2 m
This module is available with 3 wavelength laser sources.
It can process with the laser from the film side and from the glass side.
As an option, we offer a fast scribe or edge or fiducial tracing system.
Laser system for glove box for processing in inert atmosphere like argon or nitrogen (laser source inside)
Stand-alone laser system for processing in air (with high-power pico and femtosecond laser sources)
Laser source on top of a glove box for non-transparent samples
The glove box was made by the customer
Robots for automated sample handling
The program of the robot can be adapted by the user.
Automated samples change is requested mostly by customers who need many samples for automated analysis and evaluation of the results by artificial intelligence (AI).
The image shows automated change of crystalline silicon wafer for solar cells (cSi solar cells) and perovskite on silicon tandem cells.
Contact us
Send us your request and we will get back to you.
