Applications

  • Laser cutting of Si, SiC, GaAs ond other wafer

  • Laser processes for battery electrodes with multiple wavelength laser system

  • Laser induced forward transfer (LIFT) “laser printing” of whole electric thin-film devices

  • Laser cutting of ultra thin glass (UTG)

  • Cutting of glass, sapphire and other substrates via laser scribe and break

  • Repair of micro electronics

  • Laser processes for wafer based crystalline silicon solar cells (c-Si)

  • Laser processes for perovskite solar cells (PSC)